FPGA - Low Power

The Microsemi IGLOO® series of low-power flash FPGAs includes IGLOO/e, IGLOO nano and IGLOO PLUS - the industry's low-power FPGAs. IGLOO FPGA family are designed to meet the demand of low power and small foot print requirements of today's portable and power-conscious electronics. The IGLOO low-power FPGA family support up to 35K logic elements with up to 504 kbits of true dual-port SRAM, up to 6 embedded PLLs, and up to 620 user I/Os. Low-power applications that require 32-bit processing can use the ARM ® Cortex-M1 processor without license fee or royalties in M1 IGLOO devices. The IGLOO FPGA family devices are available in small footprint (3x3, 4x4, 5x5, 6x6 and 8x8 mm), high density, chip-scale and quad flat no-lead packages. The IGLOO series includes: - IGLOO/e with ARM Cortex-M1 - IGLOO nano - IGLOO PLUS

Features

Flash*Freeze Technology

The Flash*Freeze technology used in IGLOO devices enables easy entry and exit from low power mode which consumes as little as 2 µW, while retaining SRAM and register data. Flash*Freeze technology simplifies power management through I/O and clock management without a need to turn off voltages, I/Os, or clocks at the system level.In Flash*Freeze mode, power drops to as low as 2 µW, and no additional components are required to turn off I/Os or clocks while preserving the design information, SRAM content, and registers. I/Os can maintain their state during Flash*Freeze mode. Entering and exiting Flash*Freeze mode takes less than 1 µs.

Small Footprint Packages

Microsemi IGLOO low-power FPGAs are true single-chip devices, do not require configuration or other support components, and offer a variety of small-footprint packages with high I/O pin count to match design needs. The Microsemi IGLOO family is offered in a small form factor (3x3, 4x4, 5x5, 6x6, and 8x8 mm), high-density, chip-scale packages and quad flat no-lead packages

Specifications

Device Comparison

IGLOO Family	IGLOO/e	IGLOO nano	IGLOO PLUS
ARM - Enabled	M1 IGLOO/e
Overview	The low-power programmable solution	The industry's lowest-power, smallest-size solution	The low-power FPGA with more I/O per LE compared to IGLOO
Equivalent LEs	330-35K	100-3K	330-1K
Max User I/Os	620	71	212
Power Consumption	5  µW	2  µW	5  µW

Microsemi extends its non-volatile FPGA leadership with the PolarFire family of cost-optimized FPGAs. PolarFire FPGAs deliver up to 50% lower power than equivalent SRAM FPGAs. The devices are ideal for a wide range of applications within wireline access networks and cellular infrastructure, defense and commercial aviation markets, as well as industrial automation and IoT markets Cost-optimized Architecture •Architecture and process optimizations for 100K/500K LE devices •Transceiver performance optimized for 12.7 Gbps, which yields smaller size •1.6 Gbps I/Os—hardened I/O gearing logic with CDR (supports SGMII/GbE links on these GPIOs) •Best-in-class high-performance, hardened security IP in mid-range devices Power Optimization •The lowest static power—1/10 static power vs. competing devices •Transceiver optimized for 12.7 Gbps, which yields 1/2 the power vs. competing devices •Low power Flash*Freeze mode yields best-in-class standby power •Integrated hard IP—DDR PHY, PCIe endpoint/root port, crypto processor •Total power (static and dynamic)—up to 50% lower power

Microchip's PolarFire Evaluation Kit offers high-performance evaluation across a broad class of applications. This kit is ideally suited for high-speed transceiver evaluation, 10Gb Ethernet, IEEE1588, JESD204B, SyncE, CPRI and more. The kit connections include a high pin count (HPC) FPGA mezzanine card (FMC), numerous SMAs, PCIe, Dual Gigabit Ethernet RJ45, SFP+ and USB. A 300K logic element (LE) PolarFire FPGA with DDR4, DDR3, and SPI-flash allow a broad class of high-performance designs to be developed.

Features

Kit Contents – MPF300-EVAL-KIT 1 PolarFire Evaluation Kit Board with MPF300TS-1FCG1152I Device 1 12V Power Pack/AC Adapter 1 USB 2.0 A male to Mini-B 1 QuickStart Card 1 1 Year Gold Software License included with kit ($995 value) - Supports PolarFire 100K, 200K LE devices and the, MPF300TS-1FCG1152I/EES and MPF300TS-1FCG484I/EES (Kit Devices)

These flash FPGA devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system management and secure connectivity. Microsemi FPGAs are used by customers in Communications, Industrial, Medical, Defense, and Aviation markets.

Features

SmartFusion2 SoC FPGAs offer 5K-150K LEs with a 166MHz ARM® Cortex™-M3 processor, including ETM and Instruction Cache with on-chip eSRAM & eNVM and a complete Microcontroller Subsystem with extensive peripherals including CAN, TSE, & USB. - Up to 150K LEs, 5Mbit SRAM, 4Mbit eNVM - Hard 667 mbps DDR2/3 controllers - Integrated DSP processing blocks - Power as low as 7mW Standby, Typical - DPA Hardened, AES256, SHA256 - On-Demand NVM Data Integrity Check - SEU Protected/Tolerant Memories: eSRAMs, DDR Bridges

The Industry's Low-Power FPGAs The IGLOO® series of ultra-low density FPGAs includes IGLOO/e, IGLOO nano and IGLOO PLUS IGLOO FPGA—the industry's low-power FPGAs. IGLOO FPGA family are designed to meet the demand of low power and small foot print requirements of today's portable and power-conscious electronics. The IGLOO low-power FPGA family support up to 35K logic elements with up to 504 kbits of true dual-port SRAM, up to 6 embedded PLLs, and up to 620 user I/Os. Low-power applications that require 32-bit processing can use the ARM ® Cortex-M1 processor without license fee or royalties in M1 IGLOO devices. The IGLOO FPGA family devices are available in small footprint (3x3, 4x4, 5x5, 6x6 and 8x8 mm), high density, chip-scale and quad flat no-lead packages.

Features

Microsemi's IGLOO® nano low-power FPGAs offer groundbreaking possibilities in power, size and operating temperature. Available in logic densities from 100 LEs to 3K LEs, the 1.2 V to 1.5 V IGLOO nano devices have been designed for high-volume applications where power and size are key decision criteria. - Ultra-low power in Flash*Freeze mode, as low as 2 µW - Variety of small footprint packages as small as 3x3 mm - Best system performance of 250 MHZ - Enhanced commercial temperature - Reprogrammable flash technology - 1.2 V to 1.5 V single voltage operation - Enhanced I/O features - Clock conditioning circuits (CCCs) and PLLs

PolarFire FPGAs offer various device offerings such as design security with transceivers, low power transceiver devices, data security with transceivers, and low power data security with transceiver devices. All PolarFire FPGAs are integrated with multi-protocol industry-leading low-power transceivers. Low power (L) devices provide up to 35% lower static power. Also, data security (S) devices have an integrated DPA safe crypto accelerator

Features

Cost-Optimized Architecture • Transceiver performance optimized for 12.7 Gbps, which yields smaller size • Architecture and process optimizations for specific bandwidths (10 Gbps–40 Gbps) at specific densities • 1.6 Gbps I/Os—best-in-class hardened I/O gearing logic with CDR (supports SGMII/GbE links on these GPIOs) • High-performance, best-in-class hardened security IP in mid-range devices

Specifications

Power Optimization • The lowest static power—28 nm non-volatile process yields very low static power • Optimized for 12.7 Gbps, which yields the lowest power • Low-power modes—Flash*Freeze yields best-in-class standby power • Integrated hard IP—DDR PHY, PCIe endpoint/root port, crypto processor • Total power (static and dynamic)—up to 50% lower power

PolarFire® SoC is built upon the award-winning PolarFire FPGA non-volatile FPGA platform. Featuring a five core Linux capable processor subsystem based on the RISC-V ISA, PolarFire SoC brings to market an innovative, midrange, embedded compute platform that inherits all the benefits of the PolarFire FPGA product family. The RISC-V CPU micro-architecture implementation is a simple, 5-stage single issue in order pipeline that does not suffer from the Meltdown and Spectre exploits found in common out-of-order machines. All five CPU cores are coherent with the memory subsystem allowing a versatile mix of deterministic real time systems and Linux in a single, multi-core CPU cluster. With Secure Boot built-in, innovative Linux and Real Time modes, a large Flexible L2 memory subsystem, and a rich set of embedded peripherals, PolarFire SoC provides designers new choices in secure, power-efficient, embedded compute platforms. This document describes the features of PolarFire SoC extended commercial (0 °C to 100 °C Tj) and industrial (–40 °C to 100 °C Tj) device offerings.

Features

- 64-bit RV64GC Quad Application processing cores - Memory Management Unit (MMU) - Physical Memory Protection (PMP) unit - Flexible 2 MB L2 memory subsystem with SECDED - Integrated 36-bit DDR4/DDR3/LPDDR4/LPDDR3 memory controller with SECDED

The ProASIC3 nano nonvolatile FPGAs offer the advantage of being a secure, low power, instant-on,single-chip solution. ProASIC3 nano devices are reprogrammable and offer time-to-market benefits.When measured against the typical project metrics of performance, cost, flexibility and time to market, the ProASIC3 nano devices provide an attractive alternative to ASICs and application-specific standard products (ASSPs) in fast moving or highly competitive markets. ProASIC3 nano devices have up to 3K LEs, supported up to 36 kbits of true dual-port SRAM and up to 71 user I/Os. ProASIC3 nano devices increase the breadth of the ProASIC3 product line by adding new features and packages for greater customer value in high volume consumer, portable, and battery-backed markets.

Features

- Enhanced commercial temperature range - Selectable Schmitt trigger inputs - Hot-swappable and cold-sparing I/Os - Reprogrammable and nonvolatile - 1,024 bits of user flash memory - Single-chip and Instant-ON

These flash FPGA devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system management and secure connectivity. Microchip FPGAs are used by customers in Communications, Industrial, Medical, Defense, and Aviation markets.

Features

- ARM Cortex-M3 Processor with embedded flash - Comprehensive microcontroller subsystem - PCIe Gen2 support in 10K LE - Lowest Power - Reduce total power by ~20-40% - 70mW per 5G SERDES (PCIe Gen2) - Protection from Overbuilding and Cloning - Secure Boot for FPGA & Processors

The Microsemi FlashPro programming system is a combination of Microsemi FlashPro software and a hardware programmer. Together they provide in-system programming (ISP) for all FPGAs in the IGLOO2, SmartFusion2, RTG4, IGLOO® Series and ProASIC3 Series (including RT ProASIC3), and the SmartFusion, Fusion, ProASICPLUS, and ProASIC families. Flashpro5 is a hardware programmer supporting all SoC FPGA and FPGA devices except ProASICPlus on Windows and SmartFusion2/IGLOO2 devices on Linux Whether you are programming a board containing a single device or multiple devices connected in a chain, you can quickly program and reprogram Microsemi flash FPGAs by connecting to a PC and the target board. FlashPro programmers provide everything you need to program flash FPGAs for compliance with IEEE 1149, using the JTAG port. Click here for more information

The ProASIC®3 series of FPGAs, which includes ProASIC3/e, ProASIC3 nano, and ProASIC3L, offers a breakthrough in performance, density, and features for today's most demanding high-volume applications. ProASIC3 devices support the ARM - Cortex-M1 soft processor IP core, offering the benefits of programmability and time-to-market. The ProASIC3 families are based on nonvolatile flash technology and support 100 to 35K LEs and up to 620 I/Os. Military grade devices support 3K to 35K logic elements and 32-bit Cortex M1 soft processor implemented in the FPGA.

Features

- Enhanced commercial temperature range - Selectable Schmitt trigger inputs - Hot-swappable and cold-sparing I/Os - Reprogrammable and nonvolatile - 1,024 bits of user flash memory - Single-chip and Instant-ON

Microsemi's IGLOO®2 FPGAs, targeted at the cost-optimized FPGA market, integrate fourth generation flash-based FPGA fabric and high performance communications interfaces on a single chip. The IGLOO2 FPGAs offer a cost optimized FPGA with best-in-class feature integration coupled with the lowest power, highest reliability and most advanced security in the industry. Best-In-Class: Integration, Power, Reliability & Security Microsemi Leadership in Cost-Optimized FPGAs - Highest number of 5G transceivers - Highest number of GPIO - Highest number of PCI Compliant 3.3V I/O - Only FPGA with hardened memory subsystem - Only non-volatile and instant-on mainstream FPGA Microsemi Leadership in Low Power FPGAs - 3X lower static power with no performance penalties - Flash*Freeze real-time power management - 25% lower total power Microsemi Leadership in Reliable FPGAs - Only FPGA with SEU immune fabric configuration cells - Extended temperature support (Up to 125degC Tj) Microsemi Leadership in Secure FPGAs - Built-in state-of-the-art design security for all devices - Easy-to-use!

Features

Microsemi's IGLOO2 FPGAs continue the company's focus on addressing the needs of today's cost optimized FPGA markets by providing a LUT based fabric, 5G transceivers, high speed GPIO, block RAM and DSP blocks in a differentiated, cost and power optimized architecture. This next generation IGLOO2 architecture offers up to 5X more logic density and 3X more fabric performance than its predecessors and combines a non-volatile Flash based fabric with the highest number of general purpose I/O, 5G SERDES interfaces and PCI Express end points when compared to other products in its class