Bluetooth

The EHBLE-Kit (Energy Harvesting Bluetooth Low Energy) kit is created to enable you to build a simple kit to show how a BLE device can be powered using Energy Harvesting. The kit provides an E-Peas AEM10941 PV harvestor with the Silicon Labs BGM220 or BGX220 kits.

DEVELOPMENT KIT FOR BL652-SA MOD - BL652-SA Transceiver; Bluetooth® Smart 4.x Low Energy (BLE) 2.4GHz Evaluation Board

DEV KIT FOR 451-00001 BL654 MODU - BL654 Transceiver; Bluetooth® 5 13.56MHz, 2.4GHz Evaluation Board

SUMMIT SOM 8M PLUS 1GB DEV KIT - 88W8997, Summit SOM 8M Plus Transceiver; 802.11 a/b/g/n/ac (Wi-Fi, WiFi, WLAN), Bluetooth® 5 2.4GHz, 5GHz Evaluation Board

LYRA SERIES - BLUETOOTH V5.3 PCB Bluetooth Bluetooth v5.3 Transceiver Module 2.4GHz Integrated, Chip Surface Mount

Overview coming soon - Call 01527 830800 for information

Features

Bluetooth 5.0 certified HFP 1.7 (HF Unit Role Only), HSP 1.2, A2DP 1.3 (Source and Sink), SPP 1.2, AVRCP 1.6, PBAP 1.2 Supports Bluetooth classic (BR/EDR) and Bluetooth Low Energy (BLE) General Attribute Profile (GATT) and General Access Profile (GAP) AAC and SBC decoding Bluetooth Low Energy Data Length Extension (DLE) and secure connection

M70 Bluetooth Low Energy module is designed for easy implementation into a broad range of applications. It delivers up to 2.5x throughput improvement and more secure connections vs. Bluetooth 4.1 based products. Developers can easily interface to the device via a standard UART interface, available on most Microcontrollers and Processors. The BM70 has a completely integrated Bluetooth software stack, and offers a shielded regulatory certified version with built-in antenna. Developers are freed from the complexities of Bluetooth Software and RF development and can simply utilize the BM70 as a wireline replacement. Perfect for IoT (Internet of Things) applications, when interfaced to a BLE enabled smartphone or Bluetooth Internet Gateway, applications can be monitored, controlled and updated from anywhere in the world.

Features

- Bluetooth 5 Certified - Module certified for use in USA, Canada, -Europe, Japan, Korea, Taiwan and China -Mobile Application supported in Microchip - Bluetooth Data (MBD) - Latest Firmware Revision: 1.11 - (BM70BLEx1FC2-0B04AA) - Supports LE Secure Connections levels 1-3 - UART interface - 3 x PWM supported - Main Crystal : 32MHz

Specifications

Firmware Release Summary, : BM70BLEx1FC2-0B05BA - FW 2.03 is a maintenance release for IS1870, IS1871, BM70, and BM71. Firmware version 2.0.3 adds new features/ removes limitations in previous release 1.11 and fixes Sweyntooth vulnerability. BM70BLEx1FC2-0B04AA - FW 1.11 - Fixes bug with invalid Bluetooth address. Refer to Errata document for more information. BM70BLEx1FC2-0B03AA - FW 1.06 - Added support for the BM71 among other bug fixes. BM70BLEx1FC2-0002AA - FW 1.03 - Initial Release.

The MCP3914 ADC Evaluation Board for 16-Bit MCUs system provides the opportunity to evaluate the performance of the MCP3914 eight-channel AFE. It also provides a development platform for 16-bit PIC® based applications, using existing 100-pin PIC microcontroller Plug-in Module (PIM) systems that are compatible with the Explorer 16 and other high pin count PIC® based demo boards. The system comes with a programmed PIC24FJ256GA110 PIM module that communicates with the Energy Management Utility software for data exchange and ADC setup via a USB connection to the board.

Overview coming soon - Call 01527 830800 for information

The World’s Smallest Bluetooth SiP Module Silicon Labs’ BGM121 Blue Gecko SiP Bluetooth Module has +8 dBm TX power and is targeted for applications where ultra-small size, reliable high performance RF, low-power consumption and easy application development are key requirements. At 6.5 x 6.5 x 1.4 mm, the BGM121 module fits applications where size is a constraint. BGM121 also integrates a high performance, ultra robust antenna, which requires minimal PCB, plastic and metal clearance. The total PCB area required by BGM121 is only 51 mm². The BGM121 also integrates a Bluetooth 4.2 compliant Bluetooth stack and it can also run end-user applications on-board or alternatively used as a network co-processor over one of the host interfaces.

BGM220-EK4314A

The BGM220 Explorer Kit is an ultra-low cost, small form factor development and evaluation platform for the BGM220P WirelessGecko Bluetooth® Module

The BGM220 Explorer Kit is focused on rapid prototyping and concept creation of IoTapplications. It is designed around the BGM220P Module, based on the EFR32BG22 System-on-Chip, which is an ideal device family for developing energy-friendly connected IoT applications.The kit features a USB interface, an on-board SEGGER J-Link debugger, one user-LEDand button, and support for hardware add-on boards via a mikroBus socket and a Qwiicconnector. The hardware add-on support allows developers to create and prototype applications using a virtually endless combination of off-the-shelf boards from mikroE,sparkfun, AdaFruit, and Seeed Studios.

Features

Small Form Factor Kit

- EXP compatible breakouts

Target device

- BGM220PC22HNA - Secure Bluetooth 5.2 module - 76.8 MHz, ARM Cortex-M33 with 512 kB of flash and 32 kB RAM - Bluetooth 5.2 Radio with supported for direction finding and LE coded PHY - 38.4 MHz HFXO crystal - 32.768 kHz LFXO crystal - 2.4 GHz matching network and a chip antenna

On-board Board controller

- J-Link debugger - SWD physical layer - Packet trace over UART/async protocol - Virtual COM with hardware flow control

USB Micro-B connector for debug connection

User interface features

- 1x button (with EM2 wake-up) - 1x LED

Mini Simplicity Debug Connector (SLSDA001A compatible) with access to

- AEM - PTI - VCOM - SWD

Third-party add-on connectors

- mikroBus socket - Qwiic connector

The EFR32xG24 Dev Kit is a compact, feature-packed development platform. It provides the fastest path to develop and prototype wireless IoT products. The development platform supports up to +10 dBm output power and includes support for the 20-bit ADC as well as other key features. With the the xG24’s AI/ML hardware accelerator, this is the ideal development board for AI/ML development including platforms from TinyML, Edge Impulse, SensiML and MicroAI.

Features

- Based on EFR32MG24B310F1536IM48 2.4 GHz Wireless SoC - +10 dBm, 1536 kB Flash, 256 kB RAM, 6x6 QFN48 - SecureVault High - AI/ML Hardware Accelerator - Packet Trace Interface - Virtual COM port - J-Link on-board debugger supporting SWD - External device debugging - USB connectivity - User LED and pushbuttons - Si7021 RHT Sensor - Intertial Sensor - Stereo microphones - Pressure Sensor - Ambient light sensor - Hall-effect sensor - CR2032 coin cell battery support