Microchip

The Microsemi IGLOO® series of low-power flash FPGAs includes IGLOO/e, IGLOO nano and IGLOO PLUS - the industry's low-power FPGAs. IGLOO FPGA family are designed to meet the demand of low power and small foot print requirements of today's portable and power-conscious electronics. The IGLOO low-power FPGA family support up to 35K logic elements with up to 504 kbits of true dual-port SRAM, up to 6 embedded PLLs, and up to 620 user I/Os. Low-power applications that require 32-bit processing can use the ARM ® Cortex-M1 processor without license fee or royalties in M1 IGLOO devices. The IGLOO FPGA family devices are available in small footprint (3x3, 4x4, 5x5, 6x6 and 8x8 mm), high density, chip-scale and quad flat no-lead packages. The IGLOO series includes: - IGLOO/e with ARM Cortex-M1 - IGLOO nano - IGLOO PLUS

Features

Flash*Freeze Technology

The Flash*Freeze technology used in IGLOO devices enables easy entry and exit from low power mode which consumes as little as 2 µW, while retaining SRAM and register data. Flash*Freeze technology simplifies power management through I/O and clock management without a need to turn off voltages, I/Os, or clocks at the system level.In Flash*Freeze mode, power drops to as low as 2 µW, and no additional components are required to turn off I/Os or clocks while preserving the design information, SRAM content, and registers. I/Os can maintain their state during Flash*Freeze mode. Entering and exiting Flash*Freeze mode takes less than 1 µs.

Small Footprint Packages

Microsemi IGLOO low-power FPGAs are true single-chip devices, do not require configuration or other support components, and offer a variety of small-footprint packages with high I/O pin count to match design needs. The Microsemi IGLOO family is offered in a small form factor (3x3, 4x4, 5x5, 6x6, and 8x8 mm), high-density, chip-scale packages and quad flat no-lead packages

Specifications

Device Comparison

IGLOO Family	IGLOO/e	IGLOO nano	IGLOO PLUS
ARM - Enabled	M1 IGLOO/e
Overview	The low-power programmable solution	The industry's lowest-power, smallest-size solution	The low-power FPGA with more I/O per LE compared to IGLOO
Equivalent LEs	330-35K	100-3K	330-1K
Max User I/Os	620	71	212
Power Consumption	5  µW	2  µW	5  µW

Microchip's PolarFire Evaluation Kit offers high-performance evaluation across a broad class of applications. This kit is ideally suited for high-speed transceiver evaluation, 10Gb Ethernet, IEEE1588, JESD204B, SyncE, CPRI and more. The kit connections include a high pin count (HPC) FPGA mezzanine card (FMC), numerous SMAs, PCIe, Dual Gigabit Ethernet RJ45, SFP+ and USB. A 300K logic element (LE) PolarFire FPGA with DDR4, DDR3, and SPI-flash allow a broad class of high-performance designs to be developed.

Features

Kit Contents – MPF300-EVAL-KIT 1 PolarFire Evaluation Kit Board with MPF300TS-1FCG1152I Device 1 12V Power Pack/AC Adapter 1 USB 2.0 A male to Mini-B 1 QuickStart Card 1 1 Year Gold Software License included with kit ($995 value) - Supports PolarFire 100K, 200K LE devices and the, MPF300TS-1FCG1152I/EES and MPF300TS-1FCG484I/EES (Kit Devices)

Microsemi's SmartFusion2 Security Evaluation Kit makes it easy to develop secure embedded systems and provides the best-in-world solutions for both Design Security—when protecting your design IP is critical; and Data Security—when protecting application data is necessary. The kit provides a cost effective SoC field programmable gate array (FPGA) platform for developing cost-optimized SoC FPGA designs using Microsemi's SmartFusion2 SoC FPGAs, which integrate inherently reliable flash-based FPGA fabric, a 166 MHz ARM® Cortex®-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM, and industry-required high-performance communication interfaces—all on a single chip. In addition, the SmartFusion2 Security Evaluation comes with a large 90K LE device to make it easy to develop transceiver I/O-based FPGA designs to build PCI Express® and Gigabit Ethernet-based systems and also have room for large IP blocks to complement the design. The board is also small form-factor PCIe compliant, which will allow quick prototyping and evaluation using any desktop PC or laptop with a PCIe slot. The kit enables you to: • Evaluate the Data Security features of SmartFusion2 SoC FPGAs including: – Elliptic Curve Cryptography (ECC) – SRAM-PUF (Physically Unclonable Function) – Random Number Generator (RNG) – AES/SHA – Anti-Tamper • Develop and test PCI Express Gen2 x1 lane designs • Test the signal quality of the FPGA transceiver using full-duplex SERDES SMA Pairs • Measure the low power consumption of the SmartFusion2 SoC FPGA • Quickly create a working PCIe link with the included PCIe Control Plane Demo The board includes an RJ45 interface to 10/100/1000 Ethernet, 512 MB of LPDDR, 64 MB SPI Flash, and USB-UART connections, as well as I2C, SPI, and GPIO headers. The kit includes a 12 V power adapter, but can also be powered through the PCIe edge connector. Also included is a free Platinum License for the Libero SoC software toolset to enable FPGA development and to utilize the reference designs made available with the kit.

Features

Kit Contents: 1x SmartFusion®2 system-on-chip (SoC) FPGA 90K LE M2S090TS-FGG484 Evaluation Board 1x USB A male to micro-B male cable 1x 12 V, 2 A AC power adapter 1x Quickstart guide 1x Libero® System-on-Chip (SoC) Platinum software one year license 1x FlashPro4 programmer

SmartFusion® System on Chip (SoC) FPGAs are the only devices that integrate an FPGA fabric, ARM Cortex-M3 Processor, and programmable analog circuitry, offering the benefits of full customization and IP protection, while still being easy to use. Based on a proprietary flash process, SmartFusion SoC FPGAs are ideal for hardware and embedded designers who need a true system-on-chip (SoC) solution that gives more flexibility than traditional fixed-function microcontrollers without the excessive cost of soft processor cores on traditional FPGAs. SmartFusion SoC FPGAs provide you with: Full Design Customisability. - Create a product with exactly the features you need - Innovate and differentiate for a competitive edge - Incorporate last-minute changes with an on-chip FPGA fabric - Future-proof your design with in-application programming (IAP) capability for field upgrades - Experiment with hardware acceleration for select algorithms in FPGA fabric Intellectual Property (IP) Protection - Inherent flash FPGA IP security with a complete SoC - Snoop-free interface between microcontroller and FPGA - High design security since no bitstream download is required at power-up - Secure in-system programming (ISP) with 128-bit Advanced Encryption Standard (AES) via JTAG - FlashLock ® to prevent FPGA contents from being read back - Protection against overbuilding with customer programmable device key Ease-of-Use Increases Productivity - A single platform for your entire line of products - Libero SoC integrated design environment for both FPGA and embedded designers - Simple GUI-based configuration of complex programmable analog - Industry leading compile and debug from Keil™, IAR Systems® and GNU - Micrium supports SmartFusion devices with real time operating system (RTOS) and middleware components

Features

Microcontroller Subsystem (MSS) - Hardware industry-standard 100 MHz, 32-bit ARM Cortex-M3 CPU - Multi-layer AHB communication matrix with up to 16 Gbps throughput - 10/100 Ethernet MAC with RMII interface - Two of each: SPI, I2C, UART, 32-bit timers - Up to 512 KB flash and 64 KB of SRAM - External memory controller (EMC) - 8-channel DMA controller - Up to 41 MSS I/Os with Schmitt trigger inputs - 25 I/Os can be used as FPGA I/Os FPGA Fabric - Based on Microsemi's proven ProASIC3 architecture - 60,000 to 500,000 system gates with 350 MHz system performance - Embedded SRAMs and FIFOs - Variable aspect ratio 4,608-bit SRAM blocks - x1, x2, x4, x9 and x18 organizations - True dual-port SRAM (including x18) - Up to 128 FPGA I/Os supporting LVDS, PCI, PCI-X and LVTTL/LVCMOS standards Programmable Analog - High-performance analog signal conditioning blocks (SCB) with voltage, current and temperature monitors - Analog compute engine (ACE) offloads CPU from analog initialization and processing of analog-to-digital conversion (ADC), digital-to-analog conversion (DAC) and SCBs - Integrated ADCs and DACs with 1 percent accuracy - 12-/10-/8-bit mode ADCs with 500/550/600 Ksps sampling rate - Up to ten 15 ns high-speed comparators - Up to 32 analog inputs and 3 outputs

Microsemi single and multiport midspans are an economical and easy way to power popular devices such as WLAN access points, IP video phones, IP security cameras, security access devices, thin clients and printers over new or existing Ethernet infrastructure. Microsemi's PD-9501G is a single port solution for remote powering of current as well as emerging high power applications. The PD-9501G is designed specifically to power IEEE 802.11n and IEEE 802.3at access points, pan-tilt-zoom (PTZ) and dome cameras, IP videophones, thin clients and other high power Ethernet end terminals with 60W of power, and is also backward compatible and safe to use with any 802.3af terminal such as VoIP phones, IP cameras and wireless LAN access points. It can power both existing 10/100Base-T devices and emerging wireless Gigabit devices such as WI-MAX and wireless IEEE 802.11n access points. With the midspan's plug-and-play installation, they are easily and cost effectively implemented leveraging an existing Ethernet infrastructure while at the same time providing the assurance of a future proof network. Features: - Up to 60W of power over 4-pairs - Cisco and legacy PoE support* - IEEE802.3at compliant - Plug-and-play installation - Guaranteed uptime - AC and DC input models available

Microsemi single and multiport midspans are an economical and easy way to power popular devices such as WLAN access points, IP video phones, IP security cameras, security access devices, thin clients and printers over new or existing Ethernet infrastructure. Microsemi's PD-9601G midspan is a single port solution for remote powering of current as well as emerging high power applications. The Microsemi PD-9601G is designed to power wireless and cellular base stations, pan-tilt-zoom (PTZ) and dome cameras, physical access control with door locks, televisions and interactive displays, Point of Sales (POS) and information kiosks, thin clients and other high power Ethernet end terminals with 95W of power, and is also backward compatible and safe to use with any IEEE802.3af or IEEE802.3at terminal such as VoIP phones, IP cameras and wireless LAN access points. It can power both existing 10/100Base-T devices and emerging wireless Gigabit devices. With the midspan's plug-and-play installation, they are easy and cost effective to implement leveraging existing Ethernet infrastructure while at the same time providing the assurance of a future proof network. Features - Up to 95W of power over 4-pairs - PoH, IEEE802.3at and 802.3af compliant - Plug-and-play installation - Guaranteed uptime

Microsemi single and multiport midspans are an economical and easy way to power popular devices such as WLAN access points, IP video phones, IP security cameras, security access devices, thin clients and printers over new or existing Ethernet infrastructure. Microsemi's PD-9001GR is a single port, high-power solution for remote powering of current and emerging high power applications. Generating up to 30W, the PD-9001GR enables remote power for a new range of applications including 802.11ac Access Points, pan-tiltzoom (PTZ) cameras and video-phones. It complies with the IEEE 802.3at PoE+ standard and is backward compatible with IEEE802.3af. It can power both existing 10/100Base-T network devices and emerging wireless 1000Base-T devices such as WiMAX and wireless IEEE 802.11ac access points. Features - Single-port Gigabit PoE Midspan, 802.3at Compliant with 2-event classification - Backwards compatible with IEEE802.3af - 30W output power from -20oC to +40oC, 25W output at +55oC - 1000BaseT compatible - Safe & reliable power over existing Ethernet infrastructure, only PoE devices receive power - Automatic detection and protection of non-standard devices - Cisco and legacy PoE support - Plug-and-play installation - Guaranteed up-time

Silicone Carbide (SiC) Schottky MOSFETs offer superior dynamic and thermal performance over conventional Silicon power MosFETs. The table below summarizes the advantages of SiC vs Si power discretes.

Characteristics	SiC vs. Si	Results	Benefits
Breakdown Field	10x Higher	Lower On-Resistance	Higher efficiency
Band Gap	3x Higher	Higher operating temperature	Improved cooling
Thermal conductivity	3x Higher	Higher power density	Higher current capabilities
Positive Temperature coefficient	-	Self regulation	Easy paralleling
Temperature Independent switching behavior	-	Stable high temperature performance	Lower losses
Almost no Reverse Recovery charge	-	Lower switching losses Higher switching capabilities	Higher performance

Features

Microsemi SiC MosFETs Advantages - Best in Class RDS(on) vs Temperature: leads to lower switching losses as well as stability over the complete operating temperature range. - Longest Short Circuit Withstand Rating: highest simple easy control circuit design

SiC technology delivers higher breakdown field strength and improved thermal conductivity compared to silicon material. This enables improved performance characteristics in parameters including zero reverse recovery, temperature independent behavior, higher voltage capability and higher temperature operation to achieve new levels of performance, efficiency and reliability. Microsemi has applied its extensive expertise in power semiconductor integration and packaging to develop its family of silicon carbide power modules that deliver outstanding levels of performance, reliability and overall quality. The modules also allow designers to shrink system size and weight, while reducing total systems costs.

Silicon Carbide (SiC) Schottky Diodes offer superior dynamic and thermal performance over conventional Silicon power diodes. SiC Schottky Diode Features - Essentially zero forward and reverse recovery = reduced switch and diode switching losses - Temperature independent switching behavior = stable high temperature performance - Positive temperature coefficient of VF = ease of parallel operation - Usable 175°C Junction Temperature = safely operate at higher temperatures SiC Schottky Diode Benefits - Improved System Efficiency - Higher Reliability - Lower System Switching Losses - Lower System Cost & Reduced System Size - Smaller EMI Filter - Smaller Magnetic Components - Smaller Heat-Sink - Smaller Switches, Eliminate Snubbers

Microsemi single and multiport midspans are an economical and easy way to power popular devices such as WLAN access points, IP video phones, IP security cameras, security access devices, thin clients and printers over new or existing Ethernet infrastructure. Microsemi's PD-9002GHO Power over Ethernet (PoE) dual- port Passive Hub offers a cost effective, IEEE 802.3at compliant solution for outdoor installations, guaranteeing 30 Watts of power per port and ensuring safe and reliable operation in outdoor environment for two standard PoE data terminal. Unlike Midspans/Injectors, Passive PoE Hubs perform data connectivity between all its ports, and also deliver PoE to all ports. Unlike PoE Switches, PoE passive hubs do not have active switching components that waste power. It allows wireless LAN access points, security network cameras and other IP terminals to receive power, along with data, over standard Ethernet cables, leaving network infrastructure completely unaltered. The PD-9002GHO also offers surge protection for the AC and the PoE ports ensuring the indoor equipment is protected from outdoor surges.

Microsemi single and multiport midspans are an economical and easy way to power popular devices such as WLAN access points, IP video phones, IP security cameras, security access devices, thin clients and printers over new or existing Ethernet infrastructure. Microsemi's PD-3504G offers a cost effective, fully IEEE 802.3af compliant solution to upgrade existing infrastructures with PoE, providing a maximum of 15.4 watts of power through each port and ensuring safe operation of any standard PoE data terminal. PD-3504G provides PoE to IP telephones, wireless LAN access points, security network cameras and IP terminals to receive power, along with data, over standard Ethernet cables, leaving network infrastructure completely unaltered

Microsemi single and multiport midspans are an economical and easy way to power popular devices such as WLAN access points, IP video phones, IP security cameras, security access devices, thin clients and printers over new or existing Ethernet infrastructure. Microsemi's PD-3504G offers a cost effective, fully IEEE 802.3af compliant solution to upgrade existing infrastructures with PoE, providing a maximum of 15.4 watts of power through each port and ensuring safe operation of any standard PoE data terminal. PD-3504G provides PoE to IP telephones, wireless LAN access points, security network cameras and IP terminals to receive power, along with data, over standard Ethernet cables, leaving network infrastructure completely unaltered

Silicon Carbide (SiC) Schottky Diodes offer superior dynamic and thermal performance over conventional Silicon power diodes. SiC Schottky Diode Features - Essentially zero forward and reverse recovery = reduced switch and diode switching losses - Temperature independent switching behavior = stable high temperature performance - Positive temperature coefficient of VF = ease of parallel operation - Usable 175°C Junction Temperature = safely operate at higher temperatures SiC Schottky Diode Benefits - Improved System Efficiency - Higher Reliability - Lower System Switching Losses - Lower System Cost & Reduced System Size - Smaller EMI Filter - Smaller Magnetic Components - Smaller Heat-Sink - Smaller Switches, Eliminate Snubbers

Silicon Carbide (SiC) Schottky Diodes offer superior dynamic and thermal performance over conventional Silicon power diodes. SiC Schottky Diode Features - Essentially zero forward and reverse recovery = reduced switch and diode switching losses - Temperature independent switching behavior = stable high temperature performance - Positive temperature coefficient of VF = ease of parallel operation - Usable 175°C Junction Temperature = safely operate at higher temperatures SiC Schottky Diode Benefits - Improved System Efficiency - Higher Reliability - Lower System Switching Losses - Lower System Cost & Reduced System Size - Smaller EMI Filter - Smaller Magnetic Components - Smaller Heat-Sink - Smaller Switches, Eliminate Snubbers

The AVR-IoT WG development board is a small and easily expandable demonstration and development platform for IoT solutions, based on the AVR® microcontroller architecture using Wi-Fi® technology. It was designed to demonstrate that the design of a typical IoT application can be simplified by partitioning the problem into three blocks: • Smart - represented by the ATmega4808 microcontroller • Secure - represented by the ATECC608A secure element • Connected - represented by the WINC1510 Wi-Fi controller module .

Features

The AVR-IoT WG development board features a USB interface chip Nano Embedded Debugger (nEDBG) that provides access to a serial port interface (serial to USB bridge), a mass storage interface for easy ‘drag and drop’ programming, configuration and full access to the AVR microcontroller UPDI interface for programming and debugging directly from Microchip MPLAB® X IDE and the Atmel® Studio 7.0 IDE. The AVR-IoT WG development board comes preprogrammed and configured for demonstrating connectivity to the Google Cloud IoT Core. The AVR-IoT WG development board features two sensors: • A light sensor • A high-accuracy temperature sensor - MCP9808 Additionally, a mikroBUS™ connector is provided to expand the board capabilities with 450+ sensors and actuators offered by MikroElektronika (www.mikroe.com) via a growing portfolio of Click boards™

Overview coming soon - Call 01527 830800 for information

Features

Bluetooth 5.0 certified HFP 1.7 (HF Unit Role Only), HSP 1.2, A2DP 1.3 (Source and Sink), SPP 1.2, AVRCP 1.6, PBAP 1.2 Supports Bluetooth classic (BR/EDR) and Bluetooth Low Energy (BLE) General Attribute Profile (GATT) and General Access Profile (GAP) AAC and SBC decoding Bluetooth Low Energy Data Length Extension (DLE) and secure connection

The BM83 Bluetooth Audio Development Board (BM83 EVB) enables the user to evaluate and demonstrate thefunctionality of the BM83 audio module and IS2083BM System-on-Chip (SoC). This board is a complete, all-in-onesolution to develop multiple Bluetooth audio applications including portable speakers and headphones. The BM83EVB features an on-board PIC32 for Host MCU mode applications, an external codec to improve audio quality, adigital microphone to capture voice audio, indicator LEDs and buttons for ease of development.

Features

Package Contents • On-board microcontroller (PIC32MX450F256L) for easy operation and feature demonstration • Plug-in module (PIM) socket for external microcontroller (MCU) • STMicroelectronics codec (STA369BW) Daughter Board • Two Digital Microphone (Knowles’ SPH0641LU4H-1) Daughter Board • J-Link 6-Pin Adapter Board for IS2083BM debugging (contact factory for information about the SDK) • On-board keypad matrix (audio control buttons) that can be controlled either by the BM83 module or the onboard PIC32 MCU

Specifications

Bluetooth 5 certified BM83 module • Aux-in, MIC-In, and Stereo out ports • On-board thermistor • 2 LEDs for the Bluetooth subsystem and various other LEDs configurable by the on-board MCU • JTAG program/debug port, USB to UART port, XPRO header interfaces • Li-ion battery connector, 15V DC power jack and USB power source